Copper destined for electrical cabling require a compromise of mechanical properties and electrical resistivity. The drawing process accompanied by the formation of crystalline defects, such as gaps and dislocations, which leads to the increase in hardness, and therefore to the increase in resistivity, a very important characteristic for the conductivity and the efficiency of the cable. The scope of this work is to investigate the phenomenon of deformation texture evolution while copper wire drawn destined for electric cable-making and to understand its relationship with the electrical conductivity. In this study, we notice that the hardness and the resistivity increase with an increase of the deformation level. On the other hand, a slight decrease in the resistivity of the wires was observed after a holding time of 30 min at 260°C. The annealing of wires at 260°C for 9 min of holding time leads to a recrystallisation especially for high deformations and a gradual return of the mechanical properties and of the microstructure towards a state close to the state of the wire rod with the extension of time . The recrystallization texture is composed of the same components as the drawing texture, fibers <111>//ND (Normal Direction) and <001>//ND. The decrease in the intensity of the fiber after annealing is observed. On the other hand, the fiber <001> // ND remains stable.